STELOP has developed numerous EO Solutions and manufactured more than 1000 EO systems and devices.
As a one-stop solution provider, STELOP has a full spectrum of in-house designing and engineering expertise in Electronics, Mechanical and Optics as well as System Engineering to integrate and provide a complete system solution. STELOP takes into consideration human factor engineering, e.g. robustness, ergonomics and aesthetics in its product design. This enables STELOP to offer outstanding complementary capabilities across defence and commercial sectors.
STELOP will continue to remain at the forefront of technological challenges and development by investing strategically in R&D and increasing its collaborations with local and overseas R&D institutions.
Our Technology
Electronics design capabilities include implementation of real-time embedded operating systems and Field Programmable Gated Array (FPGA) for compactness and high speed realisation of superior and crisp images for our wide range of imaging EO products
Mechanical design capabilities include Finite Element Analysis (thermal and structural) and application of advanced composite materials in the design of tight tolerant military standard opto-mechanical parts
Optics design capabilities include designing optical assemblies for day TV camera, infrared thermal imaging camera as well as laser and advanced sensors
System engineering capabilities include cooled and uncooled thermal imager simulation and analysis, thermal signature, atmospheric modelling / analysis and advanced image processing
STELOP’s success lies in its strategic capabilities established in core sensor technologies such as Infra-Red Thermal Imaging in mid-wavelength (3-5µm) and long-wavelength (8-14µm), Image Intensifier Night Vision Imaging, Laser Range Finding and Illumination (0.9-1.54µm), as well as Visible Daylight Imaging (0.4µm -0.7µm).
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